一、崗位職責(zé)
1、Responsible in new package/ new machine platform process development, tooling design, technology setup, commissioning strip to strip or reel to reel Trim & Form。
2、Require in-depth understanding of both process physics and mechanical/ tooling to understand its process robustness and package integrity。
3、Capability to design & define jig/tray for the new package needed。
4、To understand the process integration risk and come out with a risk mitigation plan。
5、A structural way for reporting and data analysis。（芯片人才）
二、任職要求
1、Bachelor Degree or above in Mechanical Engineering/ Electrochemical/ Applied Physics or related discipline。
2、Minimum 7 years experiences in the singulation field as a process manufacturing or development engineer in a semiconductor or other relevant。
3、Hands-on experience & solid knowledge in Mechanical, Trim & Form process is necessary。
4、Hands-on experience in process singulation is also an advantage。
5、Proven capability to initiate process & tooling improvements, develop the conceptual and detailed design, and lead the improvement project through to successful implementation。
6、Demonstrated strong trim & form process & tooling development especially on high density large lead frame, dual gate & Moss Products。
7、A disciplined use of statistical methods (Minitab, DOE, Technical report writing, FMEA & etc) is required。（芯片人才網(wǎng)）
三、本文總結(jié)
更多關(guān)于「切筋工藝開發(fā)首席工程師」職位相關(guān)信息請訪問高芯圈官網(wǎng)查看，高芯圈是芯片半導(dǎo)體行業(yè)的人才求職招聘網(wǎng)站平臺，專注芯片設(shè)計、芯片封裝、芯片制造、芯片研發(fā)、半導(dǎo)體芯片、半導(dǎo)體制造、半導(dǎo)體研發(fā)等行業(yè)的人才求職招聘服務(wù)，提供求職招聘、人才篩選、薪酬報告、人事外包等服務(wù)與解決方案，芯片半導(dǎo)體職業(yè)機會盡在高芯圈。
